Dow 電子材料
台灣電路板產業國際展覽會技術海報

請見2014 TPCA Show 技術海報如下供參閱。所有檔案皆以PDF 檔呈現。

Poster 1 超薄填盲孔電鍍銅技術
Ultra Thin Viafill Plating Technology
Poster 2 通孔填孔用硫酸銅電鍍流程
Through Hole Fill Plating
Poster 3 高速直流電鍍銅製程
High Speed Direct Current Copper Electroplating Technology
Poster 4 先進垂直連續酸性電鍍銅技術
Advanced Solution for Vertical-in-Line Equipment
Poster 5 下一代電鍍錫技術
RONASTAN™ ECX Next Generation Tin Plating for Metal Resist Application
Poster 6 高效能低鈀化學沈銅
High Performance Low Pd Electroless Copper
Poster 7 水平除膠渣/化學沈銅
Universal Electroless Copper/ Horizontal Desmear/PTH
Poster 8 應用於半加成製程之先進除膠渣及化學沈銅技術
Advanced Desmear/Electroless Copper for Semi-Additive Process
Poster 9 表面處理-化學鎳金技術
Final Finishing – ENIG Technology
Poster 10 表面處理-高性能選擇性化學鎳金技術
Final Finishing – High Performance Selective ENIG Technology
Poster 11 內層連結技術
Inner Layer Bonding Technology
Poster 12 超高解析正型液態光阻
Ultra Resolution Positive-Working Liquid Photo Resist
Poster 13 應用在HDI具成本效率之填盲孔電鍍銅技術
Cost Effective Viafill Electroplating Tech on HDI Application
Poster 14 厚板高縱橫比直流電鍍銅技藝
DC Copper Plating For Thick Panel
Poster 14 應用於IC載板上高均勻性的盲孔填孔解決方案
High Uniformity Viafill Electroplating Tech on IC Substrate
Poster 14 酒石酸系化學沈銅應用於IC載板半加成製程的解決方案
Rochel Salt Type Semi-Additive Electroless Copper Plate for IC Package