Dow Electronic Materials Receives Supplier Excellence Award from ASE
Marlborough, MA - April 15, 2013
Dow Electronic Materials
Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that it is the recipient of a supplier excellence award for 2012 from ASE Group's (ASE) Kaohsiung site. Dow received the award in recognition of its successful ongoing collaborations with the semiconductor assembly and test services company related to photoresist processes and SnAg plating chemistry for advanced packaging applications. Dow's strong track record in on-time delivery and quality control were additional factors that contributed to the company's receipt of the award.
Rob Kavanagh, business director for Advanced Packaging Metallization of Dow Electronic Materials accepted the award from Simon Li, Vice President of Quality Assurance, ASE Kaohsiung Site, at ASE’s Best Suppliers of 2012 ceremony on March 15, 2013.
"At Dow, we strive to deliver the industry's strongest customer support along with the most advanced packaging materials in the marketplace," said Leo Linehan, global business director for Growth Technologies of Dow Electronic Materials. "Our Advanced Packaging Technologies business continues to focus on offering materials that address the thermal, mechanical, reliability and environmental challenges in today’s advanced packaging applications, while keeping our customer’s needs and requirements as top priority. This recognition of our success in working together with ASE to develop cost-effective IC packaging solutions is a tremendous validation of our efforts."
Dow Electronic Materials supplies materials essential for a wide range of advanced semiconductor packaging applications, including products and processes that enable the drive towards reduced form factor and increased functionality in electronic devices that require smaller and more reliable chip-to-chip and chip-to-circuit board interconnects and packages. The company’s experience in materials for front-end semiconductor manufacturing makes the company unique in the chip packaging market.
ASE is the world's largest provider of independent semiconductor manufacturing services in assembly, test, materials and design manufacturing. As a global leader geared towards meeting the industry’s ever growing needs for faster, smaller and higher performance chips, ASE develops and offers a wide portfolio of technology and solutions including IC test program design, front-end engineering test, wafer probe, wafer bump, substrate design and supply, wafer level package, flip chip, system-in-package, final test and electronic manufacturing services.
Simon Li, Vice President of Quality Assurance, ASE Kaohsiung Site, presents supplier award to
Rob Kavanagh, Advanced Packaging-Metallization Business Director, Dow Electronic Materials
Dow (NYSE: DOW) combines the power of science and technology to passionately innovate what is essential to human progress. The Company connects chemistry and innovation with the principles of sustainability to help address many of the world's most challenging problems such as the need for clean water, renewable energy generation and conservation, and increasing agricultural productivity. Dow's diversified industry-leading portfolio of specialty chemical, advanced materials, agrosciences and plastics businesses delivers a broad range of technology-based products and solutions to customers in approximately 160 countries and in high growth sectors such as electronics, water, energy, coatings and agriculture. In 2012, Dow had annual sales of $57 billion and employed approximately 54,000 people worldwide. The Company's more than 5,000 products are manufactured at 188 sites in 36 countries across the globe. References to "Dow" or the "Company" mean The Dow Chemical Company and its consolidated subsidiaries unless otherwise expressly noted. More information about Dow can be found at www.dow.com.
About Dow Electronic Materials
Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets. From advanced technology centers worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. These partnerships energize Dow's power to invent. Its key end-use applications include a broad range of consumer electronics from personal computers, to television monitors, smart phones and tablets and other mobile devices as well as electronic devices and systems used in a variety of industries. More information about Dow Electronic Materials can be found at http://www.dowelectronicmaterials.com.
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