Dow Electronic Materials Expands Its Asia CMP Manufacturing and Technical Center in Hsinchu

HSINCHU, Taiwan - March 26, 2018

Dow Electronic Materials, a business unit of DowDuPont™ Specialty Products Division, today held a ribbon-cutting ceremony for its phase four expansion at its Asia CMP Manufacturing and Technical Center in Hsinchu, Taiwan. The new building will expand manufacturing operations for the production of pads for chemical mechanical planarization (CMP).

"Our customers have long relied on our ability to scale our operations to supply materials as they experience periods of growth, and this expansion is a great example of how we are continually taking steps forward to support them," said Mario Stanghellini, Vice President and Global Business Director, Semiconductor Technologies, Dow Electronic Materials. "Investing further here at our Asia CMP Center helps us to meet customer needs into the future by leveraging the strong infrastructure and talented team we have here in Taiwan."

The Asia CMP Center has been an important part of Dow Electronic Materials' growth. Its CMP manufacturing operations first began in the U.S., and later expanded into Japan through its joint venture, Nitta Haas Inc. In 2006, Dow Electronic Materials' Asia CMP Manufacturing and Technical Center first opened its doors at the Hsinchu Science Park's Jhunan campus, to better serve customers throughout the Asia-Pacific region. Later expansions to the Asia CMP Center added a CMP applications facility, research and development for pads and slurry, and new manufacturing capabilities.

"It is an honor to host distinguished guests from near and far to join us as we celebrate the successful opening of our phase four expansion," said Cliff Chen, Hsinchu Site Leader, Dow Electronic Materials. "This is our biggest expansion in the site's 12-year history, demonstrating our commitment to the region and the value of this exceptional location to our business."

The phase four expansion, also known as the P4 building, adds capacity for the production of CMP polishing pads. It also adds new capabilities, including the ability to create new products, such as advanced CMP pads targeting very specific customer requests. Built with Lean design principles and world-class manufacturing practices, it is also equipped with state-of-the-art process control for quality and safety.

Dow Electronic Materials serves the semiconductor and related industries with leading-edge technology that supports the advancement of device shrinks and enhanced performance and productivity for semiconductor devices. The Dow Electronic Materials CMP Technologies business offers a full range of hard and soft polishing pads and slurries to meet the distinct performance needs of each CMP application and node. Since The Dow Chemical Company's (Dow) merger with E. I. du Pont de Nemours and Company (DuPont), Dow Electronic Materials and DuPont Electronics & Communications have combined their portfolios to form a new Electronics & Imaging technology leader within the DowDuPont Specialty Products division.

The Dow Electronic Materials Asia CMP Center celebrates the grand opening of its phase four expansion on March 26, 2018, in Hsinchu, Taiwan

About Dow Electronic Materials

With the 2017 merger of Dow and DuPont, Dow Electronic Materials and DuPont Electronics & Communications have combined their portfolios and expertise to create the new Electronics & Imaging business. Electronics & Imaging is a global supplier of materials and technologies serving the semiconductor, advanced chip packaging, circuit board, electronic and industrial finishing, photovoltaic, display, and digital and flexographic printing industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation technologies to address customers' needs. More information about Electronics & Imaging can be found at www.dowelectronicmaterials.com.

About DowDuPont Specialty Products Division

DowDuPont Specialty Products, a division of DowDuPont (NYSE: DWDP), is a global innovation leader with technology-based materials, ingredients and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, building and construction, health and wellness, food and worker safety. DowDuPont intends to separate its Specialty Products Division into an independent, publicly traded company. More information can be found at www.dow-dupont.com.

®™ Trademark of The Dow Chemical Company ("Dow") or E. I. du Pont de Nemours and Company ("DuPont") or affiliated companies of Dow or DuPont.


For Editorial Information:

Rebekah Lazar
Dow Electronic Materials
+1 302 509 1859
[email protected]

Amy Smith
Kiterocket
+1 401 369 9266
[email protected]

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