Dow Electronic Materials
News Archive

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2013
November 4 Dow Introduces Advanced Solutions that Enhance Performance, Reliability and Environmental Profile for Printed Circuit Boards at Productronica Show
October 9 Dow Introduces New SOLDERON™ Tin-Silver Plating Chemistry For Lead-Free Bump Plating
June 4 Dow Electronic Materials Honored with ON Semiconductor's 2012 Perfect Quality Gold Award
May 7 Dow Electronic Materials MICROFILL™ THF-100 Electrolytic Copper Wins New Product Introduction Award from PCD&F
April 15 Dow Electronic Materials Receives Supplier Excellence Award from ASE
February 1 Dow Unveils First CMP Polishing Pads from its IKONIC™ Platform
January 23 Dow Electronic Materials and Nanoco Group PLC Sign Global Licensing Agreement for Cadmium-Free Quantum Dots
2012
December 3 Dow Electronic Material Extends Leadership in Advanced Semiconductor and Printed Circuit Board Technologies for the Next Generation Manufacturing
September 5 New IKONIC™ Pad Platform Targets Advanced Applications
September 5 Dow Launches Next-Generation CMP Polishing Pad Platform
May 30 Dow Electronic Materials Wins New Product Introduction Award
May 23 Dow Electronic Materials Wins Unimicron’s First-Ever Best Supplier Award
May 16 Dow Electronic Materials Expands its LED Technologies’ Portfolio to Include Specialty Phosphor Technology
May 8 Dow’s KLEBOSOL® II 1730 Slurry
May 8 Dow’s VISIONPAD™ Polishing Pad Series
March 21 Dow Launches Global R&D Center for Electronic Materials
March 21 Dow Seoul Technology Center: New Global R&D; Center for Electronic Materials
March 20 Dow Electronic Materials Launches High-Performance KLEBOSOL® II 1730 Dilutable Colloidal Silica Slurry for CMP
March 20 Dow Electronic Materials Brings Advanced LED Materials Portfolio to Market
February 7 Dow Electronic Materials to Showcase Full Range of Semiconductor, LED and Advanced Packaging Solutions at SEMICON Korea
2011
December 13 Dow Electronic Materials Develops Tin CVD Precursor for New Electronic Devices
December 5 Dow Electronic Materials Honored with 2011 TSMC Supplier Excellence Award
November 8 Dow Electronic Materials Presents Innovations for Circuit Density and Reliability At Electronic Circuits World Convention
October 4 Dow Becomes First Materials Supplier to Install 193 nm Immersion Scanner in Korea [#DowInvestorDay]
October 4 Dow Electronic Materials Expands Manufacturing of Chip Packaging Materials [#DowInvestorDay]
October 4 Dow Electronic Materials Launches LED Technologies Business [#DowInvestorDay]
August 15 26th EU PVSEC: Dow to Highlight Comprehensive Range of Materials for Improving Performance, Lowering Total System Costs
August 3 Dow Electronic Materials Wins First Prize Award from Multek
May 10 Dow Electronic Materials Wins New Product Introduction Award
May 4 Dow Electronic Materials Wins Epistar’s First-Ever Supplier Award for Supply of Metalorganic Precursors and Exceptional Customer Support
March 7 Tekcore Installs First of Several VAPORSTATION™ Central Delivery Systems