CPCA Show Posters

Dow Electronic Materials
CPCA Show Posters

View the posters Dow Electronic Materials is showcasing at the CPCA Show, March 15-17, 2016 in Shanghai, China. All posters are provided as Adobe Acrobat PDF files.

	Cost Effective Viafi ll Electroplating on HDI Application 应用在HDI具成本效率之填盲孔电镀铜技术
	DC Copper Plating for Thick Panel 厚板高纵横比直流电镀铜技术
	Excellent Uniformity Viafi ll Electroplating Technology on IC Substrate 应用于IC载板上高均匀性的盲孔填孔解决方案
	Next Generation Horizontal Electroless Copper Process with Ionic Catalyst System for ELIC and IC Substrate Application 下一世代水平化铜程序（离子钯系统）应用于ELIC及IC载板制程的解决方案
	Advanced Solution for High Speed Direct Current Copper Pillar Technology 先进解决方案高速直流电镀铜柱技术
	Next Generation High Throwing Power Solution on Flexible Board Electroplating Application 应用于软板上具高深镀能力的下世代电镀药水
	High Speed Direct Current Copper Electroplating Technology 高速直流电镀铜制程
	Advanced Solution for Vertical-in-Line Equipment 先进垂直连续酸性电镀铜技术
	Next Generation Tin Plating for Metal Resist Application 下一代电镀锡技术
	Horizontal Desmear/PTH Universal Electroless Copper 水平去胶渣/化学沉铜 泛用型化学沉铜
	Final Finishing – High Performance Selective ENIG Technology 表面处理–高性能选择性化学镍金技术
	Inner Layer Bonding Technology 内层连结技术
	Advanced Desmear / Electroless Copper for Semi-Additive Process 应用于半加成制程之先进除胶渣及化学沉铜技术
	Rochel Salt type Semi-Additive Electroless Copper Plate for IC Package 酒石酸系化学沉铜应用于IC载板半加成制程的解决方案
	Cleaner for Both Electroless and Electroplated Copper Surface 适用于化学铜与电镀铜的清洁剂
	Green Products 绿色产品