HKPCA & IPC Show

6 – 8 Dec, 2017

2017 International Printed Circuit & APEX South China Fair

Shenzhen Convention and Exhibition Center, China (Hall 2, Booth 2H11)

We’re looking forward to the HKPCA & IPC Show 2017 where this year we’re all about big solutions for advances in tomorrow’s electronics!

在今年的HKPCA & IPC展会，期待与您分享，我们为电子产业进步而研发的解决方案

Date 日期: Thursday, Dec 07
Time 时间: 13:30 – 14:15
Location 地点: Hall 4
Lead Author 演讲人: Mr. Robert Pan (C&IT; marketing announcement, BD Leader- PCB Metallization, EP)/ Dr. Mark Lin (林賢勳博士), Riston® R&D; Manager
Topic 主题:
- SFP for IC PKG and Potential for Smartphone Advanced Pattern Plating (新世代均匀性改善及镀薄铜填孔电镀铜技术)
- Novel Fine-line Riston® LDI Photo-resist for Advanced MSAP Application (新世代雷射曝光專用光阻於細線路類載板先進製程之應用)
Read Connectivity Blog 閱讀Connectivity博客

View the posters Dow Electronic Materials is showcasing at the HKPCA & IPC Show, Dec 6-8, 2017. All posters are provided as Adobe Acrobat PDF files.

	Cost Effective Viafill Electroplating on HDI Application 应用在HDI具成本效率之填盲孔电镀铜技术 Download the Poster
	Excellent Uniformity Viafill Electroplating Technology on IC Substrate 应用于IC载板上高均匀性的盲孔填孔解决方案 Download the Poster
	Next Generation Vertical Electroless Copper Process with Ionic Pd Catalyst System for High-end products 应用于高端线路板之下一世代垂直化铜工艺(离子钯系统) Download the Poster
	High Performance PPR Copper Plating for HAR Boards 应用于高纵横比线路板上之高性能脉冲电镀铜 Download the Poster
	Final Finishing – High Performance Selective ENIG Technology 表面处理–高性能选择性化学镍金技术 Download the Poster
	New Generation Via Filling Acid Copper Plating Technics for Improving Distribution Uniformity and Thinner Copper 新世代均匀性改善及镀薄铜填孔电镀铜技术 Download the Poster
	New Tin Plating Technology for VCP Application 新一代应用于VCP的电镀锡技术 Download the Poster
	High Speed Direct Current Copper Electroplating Technology of High Throwing Power Solution 具有高深镀能力的高速直流电镀铜制程 Download the Poster
	Horizontal Desmear/PTH 水平除胶渣/化学沉铜 Universal Electroless Copper 泛用型化学沉铜 Download the Poster