Dow Electronic Materials
10-13 November, 2015
Hall B1, Stand # 305
We’re looking forward to the Productronica Show, where this year we’re all about big solutions for advances in tomorrow’s electronics! It’s a chance to share your needs for chemical process supply and hear about our latest technical advances for next-generation printed circuit boards.
Please stop by our booth to discuss how we can innovate together to advance electronics!
You and Dow at the Productronica Show
Big Solutions for Advances in Tomorrow’s Electronics
- LITHOJET™ 220 Etch Resist : a UV-curable acrylic hybrid ink that redefines the etching process for PCB inner-layer fabrication, improving yield and quality, and reducing manufacturing costs.
- CIRCUPOSIT™ 6500 Series Process : a new horizontal electroless copper process making use of an ionic palladium catalyst and an EDTA-free system, which improves the environmental profile and reduces costs.
- MICROFILL™ THF Electrolytic Copper : a new technology that provides through hole fill for inner core layers for IC-Substrate PCB, improving reliability, and both electrical and thermal conductivity.
- APE-free RONCACLEAN™ EVP-209 and RONACLEAN™ EVP-210-S Cleaners : specially formulated cleaners to work with both vertical in-line and horizontal equipment for fabrication of HDI and IC Substrates.