Dow Electronic Materials

For news in other languages:  English  |   한국어  |   简体中文  |   繁體中文  |   日本語

February 22 Peter Trefonas Elected SPIE Fellow
November 8 Dow Receives 2016 Taiwan National Occupational Safety and Health Award
June 22 Dow Electronic Materials Celebrates Expansion of Taiwan Site with Groundbreaking Ceremony
June 7 Dow Launches OPTIPLANE™ CMP Slurry Platform for Advanced Semiconductor Manufacturing
June 1 Sang-Ho Kang Named Global Business Director for Display Technologies in Dow Electronic Materials
May 18 Dow Named Fairchild Semiconductor's Chemical Supplier of the Year
May 5 Dow’s Peter Trefonas, Ph.D., to Receive Prestigious Perkin Medal
December 15 Dow Receives 2015 Supplier Excellence Award from Taiwan Semiconductor Manufacturing Company (TSMC)
November 17 Dow Electronic Materials Wins Prestigious R&D 100 Award for SOLDERON™ Tin-Silver Plating Chemistry
June 10 Dow Electronic Materials Taiwan Site Honored with Manufacturing Leadership Award from Frost & Sullivan
June 1 Dow Electronic Materials Presents Emerging Technologies in Display at Society for Information Display (SID) Business Conference
April 27 Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison Award
April 17 Dow Korea hosts 2015 Dow Korea Award and Dow Chemical Symposium
March 16 Dow MICROFILL™ Platform is a Four-Time Winner for Best New Product by Printed Circuit Design and Fab Magazine
January 8 LG Electronics Partners with Dow to Commercialize LGs New Ultra HD TV with Quantum Dot Technology
December 8 Dow Develops Chromium-Free Etch for Sustainable Plating on Plastic Manufacturing
November 13 Dow’s Electronic Materials Meet Industry's Next-Generation Requirements
September 24 Dow Electronic Materials to Build First, Large-Scale Quantum Dot Manufacturing Operation in Korea
August 5 Dow Receives Prestigious "Heroes of Chemistry" Award
July 10 Dow Electronic Materials Wins Texas Instruments' 2013 Supplier Excellence Award
June 17 Dow Electronic Materials Launches Solutions to Enable More Sustainable Surface Finishes
May 20 Dow Named Fairchild Semiconductor's 2013 Chemical Supplier of the Year
May 19 As Seen in Chemical & Engineering News (C&EN)
May 13 Dow Electronic Materials Brings in Sixth Win for Best New Product from Printed Circuit Design and Fab Magazine
March 24 Dow Electronic Materials' Japanese Joint Venture Honored with 2014 Toshiba Supplier Award
March 20 Dow Electronic Materials and Texas A&M University Win SPIE’s 2013 Willson Award for Best Technical Paper
February 13 Dow Electronic Materials Launches New IKONIC™ 4000 Series CMP Polishing Pads for Ceria Polishing Applications
November 4 Dow Introduces Advanced Solutions that Enhance Performance, Reliability and Environmental Profile for Printed Circuit Boards at Productronica Show
October 9 Dow Introduces New SOLDERON™ Tin-Silver Plating Chemistry For Lead-Free Bump Plating
June 4 Dow Electronic Materials Honored with ON Semiconductor's 2012 Perfect Quality Gold Award
May 7 Dow Electronic Materials MICROFILL™ THF-100 Electrolytic Copper Wins New Product Introduction Award from PCD&F
April 15 Dow Electronic Materials Receives Supplier Excellence Award from ASE
February 1 Dow Unveils First CMP Polishing Pads from its IKONIC™ Platform
January 23 Dow Electronic Materials and Nanoco Group PLC Sign Global Licensing Agreement for Cadmium-Free Quantum Dots
December 3 Dow Electronic Material Extends Leadership in Advanced Semiconductor and Printed Circuit Board Technologies for the Next Generation Manufacturing
September 5 New IKONIC™ Pad Platform Targets Advanced Applications
September 5 Dow Launches Next-Generation CMP Polishing Pad Platform
May 30 Dow Electronic Materials Wins New Product Introduction Award
May 23 Dow Electronic Materials Wins Unimicron’s First-Ever Best Supplier Award
May 16 Dow Electronic Materials Expands its LED Technologies’ Portfolio to Include Specialty Phosphor Technology
May 8 Dow’s KLEBOSOL® II 1730 Slurry
May 8 Dow’s VISIONPAD™ Polishing Pad Series
March 21 Dow Launches Global R&D Center for Electronic Materials
March 21 Dow Seoul Technology Center: New Global R&D Center for Electronic Materials
March 20 Dow Electronic Materials Launches High-Performance KLEBOSOL® II 1730 Dilutable Colloidal Silica Slurry for CMP
March 20 Dow Electronic Materials Brings Advanced LED Materials Portfolio to Market
February 7 Dow Electronic Materials to Showcase Full Range of Semiconductor, LED and Advanced Packaging Solutions at SEMICON Korea