Dow Electronic Materials
SOLDERON™ BP IN 1000 Indium Plating Chemistry

SOLDERON™ BP IN 1000 indium plating chemistry is designed for solder plating processes used in advanced wafer-level packaging for emerging applications that are sensitive to temperature. Its use minimizes substrate warpage and stress, and reduces the possibility of damaging materials in delicate devices due to significantly reduced reflow temperature. SOLDERON BP IN 1000 indium strikes a balance to achieve optimized performance, versatility and cost of ownership requirements. It extends the SOLDERON family into applications where SnAg can’t be used.

Table 1: Target applications

Optoelectronics bonding/assembly (multi-sensing CMOS image sensor, display)
3D Si die/wafer stacking
Flexible and/or coreless substrate assembly
Temperature-sensitive biosensors
Compound semiconductors (III-V materials)

Versatility
SOLDERON BP IN 1000 Indium serves a wide set of applications, from C4 bumps for conventional flip chip processes, to capping for Cu pillars, and µbumps in 3D stacking using TSV processes (Figures 1 and 2). It is also compatible with mainstream bumping photoresist materials, and can be integrated directly into existing process flows. It has demonstrated good within-die co-planarity in test vehicles during bumping and capping applications. Additionally, its low melting temperature also makes it a good option for bonding multiple thin layers.

Performance
SOLDERON BP IN 1000 Indium achieves low-temperature reflow (Figure 3), with peak temperatures around 180°C (depending on profile optimization). This is 80°C lower than typical SnAg reflow temperatures. The material demonstrates macro and micro void-free performance even after multiple reflows to form reliable interconnections across various under-bump metallization materials (Figure 4). Finally, SOLDERON BP IN 1000 Indium delivers stable and consistent performance over thermal and electrolytic aging (Figure 5).


                              C4 Bumping Application                                                                              Cu Pillar Capping Application

SOLDERON BP IN 1000 fig. 1

Figure 1: SOLDERON™ BP IN 1000 indium has versatile applications, including multi (thin)-layer bonding, C4 bumping application and Cu pillar capping. Plating condition: 2 ASD, 25°C.


                                   C4 Bumping Application                                                                    Cu Pillar Capping Application

SOLDERON BP IN 1000 fig. 2

Figure 2: SOLDERON™ BP IN 1000 indium can be used for a wide range of bumping and pillar sizes. Plating condition: 2 ASD, 25°C.


SOLDERON BP IN 1000 fig. 3

Figure 3: SOLDERON™ BP IN 1000 indium achieves low temperature reflow, 80° lower than SnAg.


SOLDERON BP IN 1000 Indium, Multiple Reflows: 1X, 5X & 10X

SOLDERON BP IN 1000 fig. 4

Figure 4: SOLDERON™ BP IN 1000 indium demonstrates void-free performance after multiple reflows. Peak reflow temp. = 180°C.


Electrolytic Aging Performance of SOLDERON BP IN 1000 Indium

SOLDERON BP IN 1000 fig. 5

Figure 5: SOLDERON™ BP IN 1000 indium bath performance shows stable plating performance over electrolytic aging and thermal aging. Plating condition: 2 ASD, 25°C.


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