Dow Electronic Materials
Gold and Gold Alloy Electroplating Products for Connectors
Dow Electronic Materials offers innovative technologies to address the performance needs of its customers for higher productivity; better functionality and stronger sustainable developments.
RONOVEL™ LB-300 Gold-Cobalt
RONOVEL LB-300 Electrolytic Gold is a mildly acidic cobalt alloyed gold product that can operate under a wide current density range. Its exceptional performance in reducing “bleed’ plating can significantly reduce gold usage and operation cost.
RONOVEL™ N Gold-Nickel
RONOVEL N Electrolytic Gold produces a nickel-alloyed gold deposit with low porosity, improved wear resistance, and good throwing power. It can be customized for barrel, rack, reel-to-reel and high-speed applications.
AURONAL™ BGA Soft Gold
AURONAL BGA Electrolytic Gold utilizes a grain refinement system that exhibits uncharacteristically high resistance to metallic contamination. It can be customized for barrel, rack, reel-to-reel and high-speed applications.
AURONAL™ BGA LF Electrolytic Gold
AURONAL™ BGA LF Electrolytic Gold deposits pure gold from an Arsenic and Lead free electrolyte and is compatible with rack, barrel or high speed reel to reel selective plating equipment. This gold can be applied over copper, copper alloy or nickel substrates and where required for adhesion promotion, the AURONAL BGA LF Strike can be applied.