Dow Electronic Materials
Palladium and Palladium Alloy Electroplating Products for Connectors
Dow Electronic Materials offers electrolytic palladium and palladium alloy products with functionality, cost efficiency and environmental performance to meet the needs of today’s applications.
PALLADURE™ 200 PalladiumDescription: Produces a ductile palladium deposit with low porosity for bonding and solderability.
PALLAMET™ 600 Palladium-NickelDescription: Produces a bright, ductile palladium-nickel deposit of approximately 80% Pd/20% Ni from a low ammonia sulfate-based (chloride-free) electrolyte, which is completely free of ammonia odor. A stable alloy composition over a wide current density range, provides a cost effective solution for reducing gold thickness.