Dow Electronic Materials
SOLDERON™ ST-300T Matte Tin

SOLDERON™ ST-300T matte tin electroplating process is the newest innovation from Dow Chemical in lead-free processes for Integrated Circuit Packages. The SOLDERON ST-300T matte tin process enables high-throughput for maximum cost benefit while delivering exceptional performance.

  • Single additive system, ease of control
  • High current density capability for high throughput in production
  • Low whisker propensity
  • Excellent solderability at lower solder pot temperature

Solderability after 8 hours steam age, 215°C SnPb SolderPot

Surface Morophology 5,000X Overview