Dow Electronic Materials
SOLDERON™ ST-300T Matte Tin
SOLDERON™ ST-300T matte tin electroplating process is the newest innovation from Dow Chemical in lead-free processes for Integrated Circuit Packages. The SOLDERON ST-300T matte tin process enables high-throughput for maximum cost benefit while delivering exceptional performance.
- Single additive system, ease of control
- High current density capability for high throughput in production
- Low whisker propensity
- Excellent solderability at lower solder pot temperature
Solderability after 8 hours steam age, 215°C SnPb SolderPot
Surface Morophology 5,000X Overview