Dow Electronic Materials
CONDUCTRON™ DP / DP-H Direct Plate

CONDUCTRON DP ProcessCONDUCTRON™ DP / DP-H Direct Plate are processes especially designed for operation in vertical and horizontal equipment respectively. The CONDUCTRON™ Process can be applied for panel plating as well as pattern plating. The system is suitable for double sided, flex/rigid-flex as well as multilayer boards.

    Key Benefits:
  • Provides excellent copper-to-copper adhesion
  • Short processing time
  • Simplified process control
  • Low process chemical consumption
  • Reduced chelate content for easy waste treatment
  • Formaldehyde-Free