Dow Electronic Materials
CONDUCTRON™ DP / DP-H Direct Plate
CONDUCTRON™ DP / DP-H Direct Plate are processes especially designed for operation in vertical and horizontal equipment respectively. The CONDUCTRON™ Process can be applied for panel plating as well as pattern plating. The system is suitable for double sided, flex/rigid-flex as well as multilayer boards.
- Provides excellent copper-to-copper adhesion
- Short processing time
- Simplified process control
- Low process chemical consumption
- Reduced chelate content for easy waste treatment