Dow On-demand Webinar: MICROFILL™ Electrolytic Copper for HDI PCBs and IC Substrates


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Smartphones and tablets have become the primary driver for the ever-increasing circuit density of today's PCB designs, and MICROFILL™ plating products deliver critical technologies to enable miniaturization of next generation devices. Dow has brought to market its MICROFILL™ THF-100 Electrolytic Copper for through-hole fill of substrate core layers, and is set to launch its MICROFILL™ LVF 3 Electrolytic Copper for enhanced microvia filling in early 2013. MICROFILL products can help meet industry needs for high density interconnect products, improve performance and reliability, and reduce cost of ownership.

MICROFILL™ THF-100 Electrolytic Copper’s advantages include:

MICROFILL™ LVF 3's advantages include:

Current Density: 1.5 A/dm²
Board thickness: 200μm
TH diameter: 100μm
Dielectric thickness: 80μm
Plating thickness: 12μm @1.1ASD

About the Presenter
Elie Najjar is a Research Scientist Manager at the Dow Advanced Materials division of Dow Chemical Company (NYSE: DOW TYO: 4850) in Marlborough, Massachusetts.

Mr. Najjar is responsible for the global development of many electroplating processes for interconnect technologies, including MICROFILL EVF and MICROFILL THF-100. A candidate for a Master of Science degree in Chemical Engineering from Northeastern University, Mr. Najjar has been involved with semiconductor and printed circuit board technologies for more than 15 years, working with Shipley, Rohm & Haas, and now Dow Chemical. He has published and presented several papers on PCB topics and holds several patents in this field.