Dow Electronic Materials
CIRCUPOSIT™ 4000 Horizontal Electroless Copper

Circuposit 4000 ProcessCIRCUPOSIT™ 4500 ELECTROLESS COPPER is a self-accelerating electroless copper bath designed for use in the horizontal mode, and can be used in either high or low build applications.

    Key Benefits:
  • Excellent performance on wide selection of resins
  • Great for thin boards or cores (thickness: 50µm)
  • Suitable for both high or low build application
  • Improved working environment with closed system
Excellent Via Coverage
Excellent Via Coverage
Fine Grain Deposit
Fine Grain Deposit