Dow Electronic Materials
CIRCUPOSIT™ 7900 Electroless Copper for SAP
Fine Grain Structure |
Excellent Via Bottom Coverage |
|
10um L/S after flash etch |
CIRCUPOSIT™ 7900 Electroless Copper Process has been specifically developed for SAP applications. The new CIRCUPOSIT™ SAP Conditioner provides uniform copper deposits by ensuring even absorbtion catalyst on dielectric materials.
-
Key Benefits:
- Fine deposit grain structure
- Excellent electroless copper coverage including in microvias
- Excellent peel strength after HAST & Reflow
- Uniform thickness
- Excellent via reliability
- High migration resistance
- Excellent bath stability