Dow Electronic Materials
MICROFILL™ | EVF Via Fill
MICROFILL™ EVF Via Fill provides enhanced microvia filling, with simultaneous through-hole plating capability, at previously unattainable surface thicknesses. Formulated to operate in existing equipment over a broad range of operating conditions, this plating bath is suitable for both HDI and IC substrate applications.
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Key Benefits:
- Low plating thickness (20 µm)
- Simultaneous microvia filling and through-hole plating
- Easy analytical procedure by conventional CVS
- Rectangle trace profile for wire bond application
- Compatible with both soluble and insoluble anodes
- Excellent reliability
100µm dia x 60µm deep, 12µm surface copper |
70µm dia x 35µm deep, 15µm surface copper |
150µm dia x 100µm deep, 20µm surface copper |
0.15mm dia x 1.0mm deep, 20µm surface copper |