Dow Electronic Materials
PALLAMERSE™ SMT 2000 Electroless Palladium
PALLAMERSE™ Electroless Palladium is an electroless palladium process specifically formulated for use in combination with DURAPOSIT™ electroless nickel baths and AUROLECTROLESS™ immersion gold baths to provide uniform ENEPIG deposits for final finishing of PWBs. The PALLAMERSE™ is an autocatalytic palladium process capable of depositing palladium coatings onto electroless nickel to meet subsequent SMT assembly requirements.
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Key Benefits:
- High bath stability
- Uniform Deposits
- Bondable with gold, copper and aluminum wire
- Excellent solderability
- Cost-effective alternative to electrolytic nickel-gold
- RoHS compliant