Dow Electronic Materials
TINPOSIT™ LF Immersion Tin
TINPOSIT™ LF Immersion Tin is an immersion tin formulation producing uniform and solderable tin deposits on properly prepared PWB substrates. The deposits maintain good solderability after multiple reflow processes, and the bath has a high tolerance for contaminants.
- Excellent solderability
- High reliability
- Whisker and dendrite formation suppressed
- Reduced galvanic corrosion
- Minimal attack on solder mask