Dow Electronic Materials
CIRCUPOSIT™ Hole Prep 4126 Sweller
Excellent Smear Removal | |
Before desmear |
After desmear |
More Dielectric Roughness Delivers Higher Adhesion |
CIRCUPOSIT™ Hole Prep 4126 is a solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent CIRCUPOSIT™ Promoter stage. This process defines a new standard for via plating. Hole Prep 4126 is formulated to process both traditional FR-4 type laminates and more advanced high Tg materials.
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Key Benefits:
- Simple single-pass process
- Excellent smear removal on high Tg laminates
- Produces excellent surface texture on hole wall
- ICD Free
- Single solvent system for ease of control
- Low solvent concentration for ease of waste treatment