Dow Electronic Materials
CIRCUPOSIT™ Hole Prep 4126 Sweller

Excellent Smear Removal
Before desmear
Before desmear
After desmear
After desmear
Circuposit 4126
More Dielectric Roughness Delivers Higher Adhesion

CIRCUPOSIT™ Hole Prep 4126 is a solvent swell product designed to enhance the resin texturing and smear removal of high Tg materials in the subsequent CIRCUPOSIT™ Promoter stage. This process defines a new standard for via plating. Hole Prep 4126 is formulated to process both traditional FR-4 type laminates and more advanced high Tg materials.

    Key Benefits:
  • Simple single-pass process
  • Excellent smear removal on high Tg laminates
  • Produces excellent surface texture on hole wall
  • ICD Free
  • Single solvent system for ease of control
  • Low solvent concentration for ease of waste treatment