Dow Electronic Materials
COPPER GLEAM™ HV-101 and COPPER GLEAM™ HV-606 Electrolytic Copper
COPPER GLEAM™ HV-101 and HV-606 electrolytic coppers are the latest offerings for panel plating in Vertical-in-Line equipment. They deliver high plating efficiency to improve productivity and reduce cost.
The COPPER GLEAM™ HV-606 bath has been developed to work with insoluble anodes to deliver high plating performance at high current densities.
- Excellent throwing power on through-holes and microvias
- Exceptional panel plating distribution
- Exceptional leveling performance on panel surface and inside through holes
- Round plated shape on via bottom
- Good thermal reliability
|Excellent Throwing Power|