Dow Electronic Materials
Lithographic Imaging and Metrology Services
At Dow Electronic Materials, we use a variety of advanced lithographic imaging and metrology equipment. We have a range of tools from g-line and i-line lithography to ArF immersion lithography, which we can make available for custom or batch tests. To better support our customers and the semiconductor industry, we are pleased to now be able to offer a variety of lithographic imaging and metrology services to you. Tests can be done on a one-time basis or long-term as a recurring event.
Use the menus below to see the lithographic tools available for use. We also have a full suite of metrology tools that can be used in conjunction with lithographic imaging performed at our facility or on wafers imaged off site. In addition to the development of new lithographic processes, materials manufactured by Dow Electronic Materials (such as photoresists, anti-reflective coatings, and ancillaries) are available. Imaging and metrology are often custom solutions as determined by the needs of the project, requiring a high level of collaboration. Please contact us using the form below to start the conversation about your potential project needs.
|Technology||Wafer Size (mm)||Capability|
|ArF (193nm Immersion)||300||Coat and Pattern|
|ArF (193nm Dry)||200||Coat and Pattern|
|KrF (248nm)||200||Coat and Pattern|
|i-line (365nm)||200||Coat and Pattern|
|100||Coat and Flood Exposure|
|Broad Band||200||Coat and Pattern|
|100||Coat and Flood Exposure|
|g-line (436nm)||100||Coat and Pattern|
|Metrology||Wafer Size (mm)||Description|
|Thin Film Measurement||100/200/300||Optical Parameter|
|Critical-Dimension Scanning Electron Microscopes (CD-SEM)||200/300||CD Measurement|
|Defect||200/300||Film Defect Inspection Tool, Patterned Defect Inspection Tool, Defect Review Tool, Scanning Electron Microscopes (SEM)|
|Scanning Electron Microscopes (SEM)||All||Scanning Electron Microscope, Cross Sectional Image|
|100/150/200||Top Down, X-ray, Back Scatter, Defect Review|
|Capability||Wafer Size (mm)||Tool Set|
|Dissolution Rate||100/150||Single Point DRM Laser, GCA, DNS|
|Optical Density||100||UV-Vis, GCA|
|Dill||10||Flood Exposure Tool, UV-Vis, GCA|
The following examples show the types of work we can do using our equipment:
Measurement of CDs across features that you specify for your patterned ArF resist wafers, including data analysis and a summary report.
ArF Imaged Wafers
Imaging of wafers patterned using our photoresist, antireflective coatings, and top coat products using immersion ArF conditions.
Measurement, review, and defect analysis (including EDX) for your patterned wafers.
The development of a new patterning process using our resists and ancillaries, based on your design requirements. Process testing using your production wafers.
Coating and ArF patterning evaluation of sample materials, including a summary of test results and data.
These examples represent a small sampling of the types of services we can offer. Lithographic imaging and metrology are often custom solutions as determined by the needs of the project, so please don’t hesitate to contact us to discuss your specific project needs.
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NOTICE: No freedom from infringement of any patent owned by Dow or others is to be inferred. Because applicable laws may differ from one location to another and may change with time, Customer is responsible for determining whether the services and the information in this document are appropriate for Customer’s use. The services discussed in this literature may not be available in all geographies where Dow is represented. Dow assumes no obligation or liability for the information in this document. References to ‘Dow’ or ‘Dow Electronic Materials’ mean the Dow legal entity providing the services to a Customer unless otherwise expressly noted. NO WARRANTIES ARE GIVEN, ALL IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE ARE EXPRESSLY EXCLUDED.