Dow Electronic Materials
Lithographic Imaging and Metrology Services

Lithographic Imaging and Metrology Services at Dow Electronic Materials

At Dow Electronic Materials, we use a variety of advanced lithographic imaging and metrology equipment. We have a range of tools from g-line and i-line lithography to ArF immersion lithography, which we can make available for custom or batch tests. To better support our customers and the semiconductor industry, we are pleased to now be able to offer a variety of lithographic imaging and metrology services to you. Tests can be done on a one-time basis or long-term as a recurring event.

Use the menus below to see the lithographic tools available for use. We also have a full suite of metrology tools that can be used in conjunction with lithographic imaging performed at our facility or on wafers imaged off site. In addition to the development of new lithographic processes, materials manufactured by Dow Electronic Materials (such as photoresists, anti-reflective coatings, and ancillaries) are available. Imaging and metrology are often custom solutions as determined by the needs of the project, requiring a high level of collaboration. Please contact us using the form below to start the conversation about your potential project needs.

Lithographic Capabilities+

Technology Wafer Size (mm) Capability
ArF (193nm Immersion) 300 Coat and Pattern
ArF (193nm Dry) 200 Coat and Pattern
KrF (248nm) 200 Coat and Pattern
i-line (365nm) 200 Coat and Pattern
100 Coat and Flood Exposure
Broad Band 200 Coat and Pattern
100 Coat and Flood Exposure
g-line (436nm) 100 Coat and Pattern

Metrology Equipment+

Metrology Wafer Size (mm) Description
Thin Film Measurement 100/200/300 Optical Parameter
Critical-Dimension Scanning Electron Microscopes (CD-SEM) 200/300 CD Measurement
Defect 200/300 Film Defect Inspection Tool, Patterned Defect Inspection Tool, Defect Review Tool, Scanning Electron Microscopes (SEM)
Scanning Electron Microscopes (SEM) All Scanning Electron Microscope, Cross Sectional Image
100/150/200 Top Down, X-ray, Back Scatter, Defect Review

Additional Toolsets+

Capability Wafer Size (mm) Tool Set
Dissolution Rate 100/150 Single Point DRM Laser, GCA, DNS
Optical Density 100 UV-Vis, GCA
Dill 10 Flood Exposure Tool, UV-Vis, GCA

Service Examples+

The following examples show the types of work we can do using our equipment:

CD Measurement
Measurement of CDs across features that you specify for your patterned ArF resist wafers, including data analysis and a summary report.

ArF Imaged Wafers
Imaging of wafers patterned using our photoresist, antireflective coatings, and top coat products using immersion ArF conditions.

Defect Analysis
Measurement, review, and defect analysis (including EDX) for your patterned wafers.

Process Development
The development of a new patterning process using our resists and ancillaries, based on your design requirements. Process testing using your production wafers.

Material Screening
Coating and ArF patterning evaluation of sample materials, including a summary of test results and data.

These examples represent a small sampling of the types of services we can offer. Lithographic imaging and metrology are often custom solutions as determined by the needs of the project, so please don’t hesitate to contact us to discuss your specific project needs.

Contact Us

First Name
Last Name
Email Address
Phone Number
 (Include Country/Area Code)
Please describe the opportunity
 Required Field

Data Privacy and Protection

The information collected in this form will only be used to ensure that we provide you with an appropriate response based upon the information you provide in the form above. We will contact you only if we need additional information to appropriately answer your question or in order to address your need. The contact information you provide, including e-mail address, may be used to respond to your request. We will not use the contact information you provide in this form for product or promotional advertising unless you specifically request to receive product news or information.


NOTICE: No freedom from infringement of any patent owned by Dow or others is to be inferred. Because applicable laws may differ from one location to another and may change with time, Customer is responsible for determining whether the services and the information in this document are appropriate for Customer’s use. The services discussed in this literature may not be available in all geographies where Dow is represented. Dow assumes no obligation or liability for the information in this document. References to ‘Dow’ or ‘Dow Electronic Materials’ mean the Dow legal entity providing the services to a Customer unless otherwise expressly noted. NO WARRANTIES ARE GIVEN, ALL IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE ARE EXPRESSLY EXCLUDED.