Dow’s VISIONPAD™ polishing pad series offers semiconductor manufacturers an unparalleled CMP platform specifically designed for current and next-generation manufacturing. Delivering improved overall process performance and reduced cost of consumables, the VISIONPAD 6000 and 5200 polishing pads further extend Dow’s ability to offer customers application-specific solutions targeted at technology improvements for polishing at advanced nodes and improved productivity at existing nodes.
Specifically, Dow’s VISIONPAD 6000 polishing pads deliver leading-edge technology designed to improve defectivity and dishing for inter-layer dielectrics (ILD) and Copper (Cu) bulk applications. In customer testing, the VISIONPAD 6000 demonstrated a 50 to 60 percent reduction in scratch defects, a 35 percent reduction in dishing and equivalent wafer non-uniformity to the IC1000™ polishing pads.
VISIONPAD 6000 Unique Features:
- Low-defect, low-hardness polymer chemistry
- Optimized pore size
- Improved defectivity and dishing
- Exceeds IC1000 polishing pad removal rate