Dow Electronic Materials Wins First Prize Award from Multek
Award Recognizes Innovations to Increase Microvia Reliability in High Density Interconnect
Fanling, Hong Kong - August 03, 2011
Dow Electronic Materials
|Dow Electronic Materials Hong Kong and South China General Manager Ken Tam (left) accepts the First Prize – Excellent Dow Team Award from BabHui Lee, Senior QA Director of Multek (right) on behalf of the company.|
Dow Electronic Materials, a business of The Dow Chemical Company (NYSE: DOW), recently received “First Prize – Excellent Dow Team Award” from Multek, a leading PCB manufacturer. The award is to recognize the company’s innovations that increase microvia reliability in High Density Interconnect (HDI). Among the 6 suppliers presented in the 2nd Multek Zhuhai PCB Quality Forum on February 25, 2011, Dow Electronic Materials was honored with the First Prize.
“We are pleased to recognize Dow Electronic Materials’ expertise in increasing microvia reliability in HDI with this award,” said BabHui Lee, Senior QA Director of Multek. “Dow Electronic Materials’ outstanding ability in failure analysis and process control, as well as innovative technology for desmear and electroless copper processes, are critical for Multek to create advances for next generation electronics.”
Dow Electronic Materials is honored to be recognized by Multek for its innovations in HDI reliability. Helen Zhang, global general manager in Dow Electronic Materials said, “Due to the strong demand for smart phones and tablets, microvia reliability for HDI has been critical to the advances for PCB. Receiving the award is a demonstration that with our outstanding technology and customer service, Dow Electronic Materials is passionately innovating with customers to create a connected world.”
Dow Electronic Materials’ solutions that increase microvia reliability in HDI include:
Desmear, the new CIRCUPOSIT™ Hole Prep 4126 Advanced Sweller, which offers excellent cleaning performance for smear removal and creates outstanding surface texture that results in higher reliability performance after electroless copper deposition. It provides cost-effective and sustainable benefits with optimized simple process and lower solvent concentration. The new Advanced Sweller is capable of handling both normal and high performance laminates with a wide operation window.
Semi-Additive Process (SAP) metallization, the new CIRCUPOSITTM 7950 Electroelss Copper, which provides high adhesion between dielectric and copper with low roughness, outstanding plating coverage on both via bottom and surface, excellent bath stability and reliability performance, making it the best choice for current and next generation ultra fine line for SAP.
®™ Trademark of The Dow Chemical Company (“Dow”) or an affiliated company of Dow.
Founded in 1978, Multek is one of the renowned PCB suppliers in the world that provides leading interconnect solutions in the electronics industry. The company has more than 13,000 workers across the globe working at four production sites, which sustains our unique possession of extensive global footprint to serve worldwide customers. Over the years, Multek is highly recognized with its industry leading development and manufacturing capabilities over full spectrum of PCB technology requirements. While all teams are working closely to achieve business growth, the company is strictly committed to a series of EHS programs for seamless operation and corporate social responsibility to cater for long term organizational development. More information about Multek can be found at www.multek.com
Dow (NYSE: DOW) combines the power of science and technology to passionately innovate what is essential to human progress. The Company is driving innovations that extract value from the intersection of chemical, physical and biological sciences to help address many of the world's most challenging problems such as the need for clean water, clean energy generation and conservation, and increasing agricultural productivity. Dow's integrated, market-driven, industry-leading portfolio of specialty chemical, advanced materials, agrosciences and plastics businesses delivers a broad range of technology-based products and solutions to customers in approximately 180 countries and in high-growth sectors such as packaging, electronics, water, coatings and agriculture. In 2014, Dow had annual sales of more than $58 billion and employed approximately 53,000 people worldwide. The Company's more than 6,000 products are manufactured at 201 sites in 35 countries across the globe. References to "Dow" or the "Company" mean The Dow Chemical Company and its consolidated subsidiaries unless otherwise expressly noted. More information about Dow can be found at www.dow.com.
About Dow Electronic Materials
Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets. From advanced technology centers worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. These partnerships energize Dow’s power to invent. Its key end-use applications include a broad range of consumer electronics from personal computers, to television monitors, cellular phones, global positioning systems, automobile safety systems, and avionics.
For Editorial Information:
Dow Electronic Materials