Dow Electronic Materials
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Dow Unveils First CMP Polishing Pads from its New IKONIC™ Pad Platform
Dow continues to bring new, advanced materials to the semiconductor market, introducing the first polishing pads from its new IKONIC™ platform. From the IKONIC™ 2000 series Dow launched the IKONIC 2020H, targeting copper barrier, HKMG and buffing applications and from the IKONIC™ 3000 series the IKONIC 3040M for use in bulk copper polishing.
Dow's new IKONIC 2020H polishing pad achieves defectivity levels significantly lower than traditional pads while maintaining removal rate. Additionally, every pad in the IKONIC 2000 series is formulated to be easily conditioned for optimal texture and longer pad life time. This improves polishing consistency and lowers overall cost of ownership. The IKONIC 3040M polishing pad delivers a significant reduction in scratch defects compared to other bulk copper pads. Additionally, IKONIC 3040M demonstrates improved topography performance and lower cost of ownership. This pad is available in a range of configurations and options for multiple applications.
