Dow’s SOLDERON™ Tin-Silver Plating Chemistry Wins Prestigious Bronze Edison Award

Enhances Performance and Productivity for Solder Bump Plating Applications in Advanced Semiconductor Packaging

MARLBOROUGH, MA - April 27, 2015

Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), today announced that its SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry was honored as a Bronze 2015 Edison Award winner in the Material Science: Manufacturing category.

Removing lead from solders used in electronics is a difficult technical challenge because it has unique properties that ensure device performance and reliability. SOLDERON BP TS 6000 Tin-Silver delivers a lead-free chemistry that not only creates critical connections in electronic devices, but also doubles the productivity with the market’s highest plating speed. The award recognizes Dow Electronic Materials for its development of this novel plating chemistry designed to provide advanced semiconductor packaging customers with a balance of performance and cost to enable the next generation of high-performance electronic devices, without the use of lead.

“This award showcases Dow’s ability to develop game-changing chemistry that advances the microelectronics industry while meeting customer and industry requirements for high-volume manufacturing,” said Cathie Markham, global R&D director, Dow Electronic Materials. “The scientists who contributed to making these advances possible have collaborated closely with our customers and industry partners to understand their challenges and requirements. It is truly an honor to have our scientists and their innovations recognized by the Edison Awards.”

Dow is proud to recognize its scientists, engineers and marketers who contributed to the development of SOLDERON BP TS 6000 Tin-Silver: Jeff Calvert, Regina Cho, Jin-Sil Choi, Lou Grippo, Masaaki Imanari, Yoon-Joo Kim, Inho Lee, Yil-Hak Lee, Won-Hyun Lee, Sang-Min Park, Jonathan Prange, Yi Qin, Alex Saniuk, Taylor Wang, Julia Woertink, Ju-Mi Yun, Sam Epstein, Scott Shpunt, Kristen Finnemore, Yung-Rai Lee, Jim MacDuff, Willis Martin, Jeff Weber, Brianna Gagnon and Jianwei Dong.

The Edison Awards ceremony took place on April 23, 2015 at the Edison Awards Annual Gala in New York City. Inspired by Thomas Edison’s persistence and inventiveness, this distinguished award recognizes innovation, creativity, and ingenuity in the global economy.

SOLDERON BP TS 6000 Tin-Silver was one of five Dow products to receive a 2015 Edison Award at the gala event. Dow’s other recognized products include BETAMATE™ Structural Adhesives, PacXpert™ Packaging Technology, POLYOX™ Water-Soluble Polymers and AFFINISOL™ HPMC HME. For more information regarding Dow’s innovations in science and sustainability, visit dow.com. 

About Dow Electronic Materials

Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets. From advanced technology centers worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. These partnerships energize Dow's power to invent. Its key end-use applications include a broad range of consumer electronics from personal computers, to television monitors, smart phones and tablets and other mobile devices as well as electronic devices and systems used in a variety of industries. More information about Dow Electronic Materials can be found at http://www.dowelectronicmaterials.com.

About Dow

Dow (NYSE: DOW) combines the power of science and technology to passionately innovate what is essential to human progress. The Company is driving innovations that extract value from the intersection of chemical, physical and biological sciences to help address many of the world's most challenging problems such as the need for clean water, clean energy generation and conservation, and increasing agricultural productivity. Dow's integrated, market-driven, industry-leading portfolio of specialty chemical, advanced materials, agrosciences and plastics businesses delivers a broad range of technology-based products and solutions to customers in approximately 180 countries and in high-growth sectors such as packaging, electronics, water, coatings and agriculture. In 2014, Dow had annual sales of more than $58 billion and employed approximately 53,000 people worldwide. The Company's more than 6,000 product families are manufactured at 201 sites in 35 countries across the globe. References to "Dow" or the "Company" mean The Dow Chemical Company and its consolidated subsidiaries unless otherwise expressly noted. More information about Dow can be found at www.dow.com.


For Editorial Information:

Jeremy Cole
+1 508 229 7047
jfcole@dow.com

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