Dow Electronic Materials Celebrates Expansion of Taiwan Site with Groundbreaking Ceremony

HSINCHU, Taiwan - June 22, 2016

Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), yesterday held a groundbreaking ceremony at its Asia CMP Manufacturing and Technical Center to mark the beginning of construction on a significant expansion project to increase production capacity for materials for chemical mechanical planarization (CMP).

The business was honored to have many distinguished guests participate in the groundbreaking event, including Hsu Yao-chang, Magistrate of Miaoli County; Chi Hsiang Tu, Director General of Hsinchu Science Park Bureau; and Jang-Hwa Leu, Deputy Director General of the Industrial Development Bureau. Many others were also in attendance, including representatives from some of Dow’s valued customers, business leaders and employees.

“We chose a theme of ‘Building on Our Partnerships’ for this exciting celebration because our customers and local relationships are highly valued,” said Mario Stanghellini, vice president and global business director, CMP Technologies, Dow Electronic Materials. “Taiwan has provided a nurturing home for our CMP business and we look forward to continued collaboration in the years ahead.”

The construction project will introduce a new multi-functional building to the business’ existing facility in Hsinchu Science Park, Jhunan Campus. This new space will be used primarily to increase manufacturing capacity for both conventional and next-generation CMP pads.

“Investing further in our Asia CMP Center allows us to better serve our customers both locally here in Taiwan and also throughout the region,” said Dennis Chen, South Asia business director, CMP Technologies, Dow Electronic Materials. “The semiconductor manufacturing industry continues to thrive and grow in this area, and our Hsinchu facility has proven to be an excellent location for supplying our customers and collaborating on technical solutions.”

Dow Electronic Materials serves the semiconductor and related industries with leading-edge technology that supports the advancement of device shrinks and enhanced performance for semiconductor devices. The CMP Technologies business offers a full range of hard and soft polishing pads and slurries to meet the unique performance needs of each CMP application and node.

Dow Electronic Materials held a groundbreaking ceremony at its Asia CMP Manufacturing and Technical Center on June 21, 2016. Invited guests included Cliff Chen, Dow Electronic Materials Hsinchu Site Leader (on left); Deputy Director General Leu of the Industrial Development Bureau in the Ministry of Economic Affairs (third from left); Mario Stanghellini, Vice President and Global Business Director, CMP Technologies, Dow Electronic Materials (fifth from left); Dr. Jim Fahey, President, Dow Electronic Materials (sixth from left); Magistrate Hsu of Miaoli County (seventh from left); Yoke Loon Lim, Greater China President, The Dow Chemical Company (eighth from left); Director General Tu of the Hsinchu Science Park Bureau in the Ministry of Science and Technology (tenth from left) and Dennis Chen, South Asia Business Director, CMP Technologies, Dow Electronic Materials (on right).

About Dow Electronic Materials
Dow Electronic Materials, a global supplier of materials and technologies to the electronics industry, brings innovative leadership to the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets. From advanced technology centers worldwide, teams of talented Dow research scientists and application experts work closely with customers, providing solutions, products and technical service necessary for next-generation electronics. These partnerships energize Dow's power to invent. Its key end-use applications include a broad range of consumer electronics from personal computers, to television monitors, smart phones and tablets and other mobile devices as well as electronic devices and systems used in a variety of industries. More information about Dow Electronic Materials can be found at www.dowelectronicmaterials.com.

About Dow
Dow (NYSE: DOW) combines the power of science and technology to passionately innovate what is essential to human progress. The Company is driving innovations that extract value from material, polymer, chemical and biological science to help address many of the world's most challenging problems such as the need for clean water, clean energy generation and conservation, and increasing agricultural productivity. Dow's integrated, market-driven, industry-leading portfolio of specialty chemical, advanced materials, agrosciences and plastics businesses delivers a broad range of technology-based products and solutions to customers in approximately 180 countries and in high-growth sectors such as packaging, electronics, water, coatings and agriculture. In 2015, Dow had annual sales of nearly $49 billion and employed approximately 49,500 people worldwide. The Company's more than 6,000 product families are manufactured at 179 sites in 35 countries across the globe. References to "Dow" or the "Company" mean The Dow Chemical Company and its consolidated subsidiaries unless otherwise expressly noted. More information about Dow can be found at www.dow.com.

For Editorial Information:

Rebekah Lazar
Dow Electronic Materials
+1 302 509 1859
[email protected]

Amy Smith
Impress Labs
+1 401 369 9266
[email protected]