Dow Electronic Materials
IPC APEX Expo 2016
15-17 March, 2016
Las Vegas, NV
Las Vegas Convention Center
Booth #921
We’re looking forward to the IPC APEX Expo 2016, where this year we’re all about big solutions for advances in tomorrow’s electronics! It’s a chance to share your needs for chemical process supply and hear about our latest technical advances for next-generation printed circuit boards.
Please stop by our booth to discuss how we can innovate together to advance electronics!
You and Dow at the IPC APEX Expo 2016 Show
Big Solutions for Advances in Tomorrow’s Electronics
Featured Products
- LITHOJET™ 223 Etch Resist : a UV-curable acrylic hybrid ink that redefines the etching process for PCB inner-layer fabrication, improving yield and quality, and reducing manufacturing costs.
- CIRCUPOSIT™ 6500 Series Process : a new horizontal electroless copper process making use of an ionic palladium catalyst and an EDTA-free system, which improves the environmental profile and reduces costs.
- MICROFILL™ THF Electrolytic Copper : a new technology that provides through hole fill for inner core layers for IC-Substrate PCB, improving reliability, and both electrical and thermal conductivity.
- APE-free RONACLEAN™ EVP-209 and RONACLEAN™ EVP-210-S Cleaners : specially formulated cleaners to work with both vertical in-line and horizontal equipment for fabrication of HDI and IC Substrates.