Connectivity: Dow News | Dow Electronic Materials

IMAPS DPC 2018 to Explore the Future of Advanced Packaging

February 26, 2018

The future of advanced packaging IMAPS Device Packaging Conference is always at the forefront of semiconductor advanced packaging, and this year, it will look into the future. Check out Dow presentations from Dow experts during this year’s event.

Dow’s Peter Trefonas Named SPIE Fellow

February 26, 2018

TrefonasThumbnail Dow’s Peter Trefonas has been named a Fellow of SPIE, the international society for optics and photonics. Trefonas has been recognized for his achievements in design for manufacturing and compact modeling.

SPN Viewpoint 2018: The Fan-Out Conversation and Memory Growth Continue

February 15, 2018

Teardown of a modern mobile device highlights a number of relevant 2018 advanced packaging trends. In this look ahead to 2018, Rob Kavanagh discusses advanced packaging trends for 2018. With the memory market is on the rise, advanced packaging suppliers will be faced with more challenges.

Dow Prepares for the 2018 SPIE Advanced Lithography Conference

January 29, 2018

The SPIE Advanced Lithography conference is known for leading-edge technical research. In 2018, Dow will present on: improving performance through LWR analysis; the trade-offs of shot noise, LER and RLS; and innovative SiARC materials for implant lithography.

Dow and DuPont Previewed Future Display Technologies at IMID 2017

December 11, 2017

The possibilities for future display technologies are seemingly endless, from OLED to flexible to quantum dot. Together Dow and DuPont recently showcased how they are advancing high performance displays with the latest materials innovations.

Dow and DuPont to Exhibit at Productronica

November 02, 2017

With the merger of Dow and DuPont freshly completed, this year’s Productronica show, taking place Nov. 14-17 in Munich, Germany, represents the first opportunity to meet with the companies post-merger. So, what will change moving forward?

Nitta Haas Receives Siltronic's Long-Term Partner Award for Polishing Materials

October 30, 2017

One of the strongest endorsements of a company’s performance and product quality is through industry supplier awards. Dow is proud to announce that its joint venture Nitta Haas has received Siltronic's Long-Term Partner Award for polishing materials.

Dow to Discuss Tin Whiskers and HDI Electroplating at 2017 IMPACT Conference

October 16, 2017

Examining the “IMPACT on Intelligent Everything,” this year's IMPACT conference will feature papers from Dow on the latest technological advances for tin whiskers and HDI electroplating.

Dow Litho Technologies Recognized with SMIC’s Best Technical Supplier Award

August 02, 2017

As a leading supplier of lithography consumables, customer satisfaction is a key performance metric. Dow’s Litho Technologies team is honored to be recognized with the Best Technical Supplier Award from SMIC, the largest semiconductor foundry in China.

Dow Electronic Materials’ James T. Fahey to Keynote Inaugural IMAPS SiP 2017 Conference

June 21, 2017

Dow’s James T. Fahey, Ph.D. will offer the afternoon keynote titled “The Evolution of Electronic Materials and the Information Age,” during the first-ever IMAPS System-in-Package conference. He will examine the semiconductor industry’s evolution and role of electronic materials.