Connectivity: Viewpoints | Dow Electronic Materials

Boric Acid-Free Nickel Electroplating: Another REACH Challenge

January 22, 2018

EU REACH continues to identify and act potentially harmful substances; boric acid and borate salts may face increased restriction. Dow is developing boric acid replacement electrolytes for nickel, with boric acid-free nickel plating already demonstrated.

Tailoring Copper Plating for Vias on IC Package Substrates

November 28, 2017

IC substrate manufacturers must innovate to be competitive in a landscape where feature dimensions continue to shrink. Copper plating chemistries optimized for IC substrates is one step manufacturers can take toward achieving their production goals.

How Silver Catalysts Enhance PCB Manufacturing

October 31, 2017

Used in many applications, silver catalysts provide a balance of features: good catalytic activity, high electrical conductivity, modest cost, and good process stability. As such, they are increasingly being explored for use in PCB manufacturing.

Flexible PCBs for Smartphones Need New Metallization Processes

September 26, 2017

Consumers are demanding ever-more functionality and battery life from their smartphones, which is driving a need for flexible PCBs (FPCBs). This article looks at design considerations of metallization processes for FPCBs, which will enable future devices.

Press-Fit Solutions Address Future Automotive Reliability Requirements

September 06, 2017

Automotive electronics have long had to meet demanding reliability standards. As a result, automotive PCBs, with millions of through holes, are migrating towards solderless press-fit interconnection solutions as an alternative to soldering.

Advanced Via Fill for HDI Applications

August 01, 2017

The smart phone market is driving improved via fill for HDI substrates, but it will also be needed for several emerging electronics markets. Continuous innovation in copper via fill is needed to meet new requirements.

The Future Is Cadmium-Free – Bright and Safe!

July 27, 2017

A key trend in electronics manufacturing is reducing the use of potentially harmful materials, such as cadmium. As a result, major global display manufacturers are moving away from cadmium-based QDs and committing to adopt cadmium-free QDs technology.

Inkjet Masking Reduces Gold Usage (and Cost) in Connectors

July 19, 2017

In the electrical connector industry, gold is frequently used because of its conductivity. Given its cost, there is a strong manufacturing need for a more effective masking procedure that can be carried out rapidly and offers improved resolution in reel-to-reel production.

Developing the Chinese Semiconductor Industry Ecosystem

May 25, 2017

With rapid growth occurring in the Chinese semiconductor industry, George Lu posits that the country needs to build out a complete supply chain to compete globally for advanced node manufacturing.

Role of Additives and Cu Purity in Advanced Package Reliability

May 02, 2017

Part 2 of our series on metallization examines the impact high density fan-out (HD FO), 2.5D and 3D packaging has on Cu plating requirements, and the role additives play in meeting requirements for advanced package reliability.