Dow Electronic Materials
CTEX PCB/SMT Show 2017
17 – 19 May, 2017
Suzhou, China
Hall C1, Stand AS12
We’re looking forward to the CTEX PCB/SMT Show 2017, where this year we’re all about big solutions for advances in tomorrow’s electronics!
It’s a chance to hear about our latest technical advances, share your thoughts for the future and investigate how we can innovate together for advances in electronics. Representatives from Dow Electronic Materials will be in attendance to discuss your challenges and opportunities.
You and Dow at the CTEX PCB/SMT Show:
Big Solutions for Advances in Tomorrow’s Electronics
NPI (New Product Introduction)
- Date: Thursday, May 18
- Time: 10:00-10:40
- Location: C1 hall, #AI25
- Speaker: Sharon Chen – Asia Engineering and Growth Development Manager
- Topic: Excellent Uniformity Viafill Electroplating Technology on IC Substrate -
MICROFILLTM LVF IV Acid Copper
NPI (New Product Introduction)
- Date: Thursday, May 18
- Time: 14:00-14:40
- Location: C1 hall, #AI25
- Speaker: Angus Zhao – Senior Scientist, R&D
- Topic: High Performance PPR Copper Plating for HAR Boards - COPPER GLEAMTM PPR-II Acid Copper
Technical Conference
- Date: Thursday, May 18
- Time: 9:30-10:00
- Location: 金雞湖國際會議中心 Room A211
- Presenter: Makoto Sakai – R&D Chemist
- Topic: Next Generation Copper Pattern Plating for IC Package Application
Technical Conference
- Date: Thursday, May 18
- Time: 10:00 - 10:30
- Location: 金雞湖國際會議中心 Room A211
- Presenter: Willetta Lai – R&D; Chemist
- Topic: Novel Cyanide Free Immersion Gold
Posters
View the posters Dow Electronic Materials is showcasing at Stand AS12 in Hall C1.