Dow Electronic Materials
PCB West 2015
15-17 September, 2015
Santa Clara Convention Center, Santa Clara, CA
Booth 107
We are excited to be exhibiting at the PCB West 2015 show in Santa Clara this year! Please stop by to discuss our new MICROFILL™ THF-100 electrolytic copper through hole filling process. We are also available to discuss any other chemical process supply needs for building your printed circuit boards.
Download and take a look at our MICROFILL™ THF-100 presentation from the link below.
Looking forward to seeing you there!
Downloads
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Copper Electroplating for HDI and IC Substrate Through Hole Fill |