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Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Showing all articles by Jianwei Dong

How Do Tin-Silver Caps Influence Reliability of Copper Pillar Applications?

July 23, 2015

As packaging technologies must address the higher performance and increased functionality of today’s electronic devices, traditional C4 bumps are reaching their limits. The industry is turning to Cu pillars as a solution for fine pitch bumping, with tin-silver caps becoming the solder capping material of choice. In this interview, Dr. Jianwei Dong explains why.

SOLDERON™ BP TS 6000 Tin-Silver Honored by the Prestigious Edison Awards for Getting the Lead Out

July 07, 2015

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In common vernacular, “getting the lead out” is a phrase that means, “hurry up!” In the electronics industry, the expression is taken quite literally, with manufacturers needing to find a lead-free alternative to tin-lead solders for wafer bumping processes. Tin-silver plating chemistry has stepped in to fill the role.