Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Showing all articles by Rob Kavanagh

2016 Outlook: Trends Driving Packaging Materials Development

January 25, 2016

Smartphone and smartwatch

If 2015 goes down in history as the year of 3D stacked memory, then it looks like 2016 may be remembered as the year for the first big adoptions of FOWLP. Dow’s Rob Kavanagh takes a look at the year ahead and the trends driving advanced packaging materials development.

Advanced Packaging Materials Adding More Value to ICs

January 22, 2016

Solid State Technology logo

Dow Electronic Materials’ Rob Kavanagh takes a look at the state of materials for advanced packaging in his 2016 Outlook now featured on Solid State Technology.