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Dow to Present at PRiME 2016: From TSV to Copper Pillars’ Transformative Technology

September 27, 2016

The Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) conference brings together leading industry players to discuss a diverse blend of electrochemical and solid-state science and technology. This year, Dow Electronic Materials will present on how TSV and copper pillars are transforming semiconductor advanced packaging technology.

Solving Data Center Reliability Challenges through Packaging

July 07, 2015

The semiconductor industry is approaching a point where 2.5D and 3D integration technologies will be required to achieve the performance, bandwidth and storage required of next-generation data centers and mobile devices. In this piece, Wataru Tachikawa explores how the entire ecosystem is rolling up its sleeves and working to overcome the remaining challenges.