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Showing all articles related to Horizontal electroless copper plating

Enabling Advanced PCB HVM with Nickel-Free Copper Plating

June 09, 2016

Advanced PCBs for high-density packaging require copper metal interconnects for both horizontal traces as well as vertical micro-via holes. Cost-effective manufacturing requires that fine-line traces and micro-via holes be formed using the same HVM processes. Learn how nickel-free electroless copper plating chemistry enables fine-pattern plating needed in advanced IC substrates.

2016 Dow Korea Award Winner Recognized for Work on OLED Efficiency

May 03, 2016

2016 Dow Korea Award Winners

The Dow Korea Award program honors outstanding work in electronic materials to support the research activities of science and engineering students in Korea. This year’s winner, Seoul National University Ph.D. candidate Kwon-Hyeon Kim was recognized for his work on OLED efficiency, demonstrating EQEs of 35.6% with horizontally oriented dipole moments.

Meeting the Horizontal Electroless Copper Plating Challenge with an Ionic Palladium Catalyst Process

November 02, 2015

Electroless copper plating with Dow’s ionic palladium catalyst process

Packaging density of electronic circuits continues to increase and must be defect-free after electroless plating. New innovations are required to meet changing demands on reliability and the increased complexity of HDI and IC package substrate boards. This post introduces Dow’s approach to horizontal electroless Cu plating to meet these challenges.