Dow Electronic Materials

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Showing all articles related to CMP for ILD

Dow to Present on Acidic CMP Slurry and Advanced Patterning at CSTIC

March 10, 2017

Dow will be at the China Semiconductor Technology International Conference with presentations on work from our CMP and lithography teams. One seminar will share findings on acidic ILD slurries, and the second will discuss lithographic materials when moving beyond 10nm.

Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 2 of 2

September 13, 2016

Part two of this interview with Dow's Adam Manzonie examines Dow’s recently launched OPTIPLANE™ CMP slurry platform, focusing on the market drivers and steps to commercialization to deliver a total solution to meet 14nm chemical mechanical planarization (CMP) requirements.

Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 1 of 2

August 17, 2016

In part one of this interview series, Dow's Adam Manzonie explains how the new OPTIPLANE™ CMP slurry platform meets requirements for 14nm node processes and below, which are much more sophisticated than those used for less advanced nodes. The OPTIPLANE™ CMP slurry family consists of Dow’s most advanced slurries for dielectric chemical mechanical planarization (CMP).

Dow Electronic Materials Launches OPTIPLANE™ CMP Slurry Platform for Advanced Semiconductor Manufacturing

June 08, 2016

OPTIPLANE CMP slurry platform for advanced semiconductor manufacturing

Advanced semiconductor manufacturing continues to follow the projections of Moore’s Law, making process specifications increasingly stringent with a greater need than ever for defect reduction. In response to these emerging requirements, Dow Electronic Materials recently launched its new OPTIPLANE™ slurry platform for chemical mechanical planarization (CMP) for advanced semiconductor devices.

Three Dow Electronic Materials Technologies Named Finalists for 2015 R&D; 100 Awards

August 19, 2015

Dow was recently highlighted as a leading innovator with 21 products selected as finalists for the 2015 R&D 100 Awards. Three of these are technologies developed by Dow Electronic Materials as market-focused solutions and commercialized in the last year.

CMP Pad Selection for 28nm Node and Beyond

July 07, 2015

The “one-size-fits-all” approach to CMP processing is no longer viable; a tunable platform of products is required to meet manufacturers ever-evolving and more technically challenging manufacturing needs. The IKONIC™ CMP pad platform is uniquely positioned to address future IC fabrication requirements because of the tunability of its materials properties.