Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Showing all articles related to Flip chip

Fast, High-purity Cu Plating Enables Next-Gen Devices

April 20, 2016

Copper (Cu) plating of mega pillar

Fan-out wafer-level packages (FOWLP) are poised for adoption in consumer mobile devices while cloud servers are driving the need for 3DIC packages. Copper (Cu) plating forms critical connections from horizontal redistribution layers (RDLs) through vertical pillars. Learn more about Dow’s approach to optimal Cu plating, as presented at the 2016 IMAPS Device Packaging Conference.

Dow’s SOLDERON™ Tin-Silver Plating Chemistry Takes Home an Oscar of Innovation

November 23, 2015

R&D 100 Winner banner for SOLDERON Tin-Silver Plating Chemistry

It’s been a banner year for SOLDERON™ BP TS 6000 Tin-Silver Plating Chemistry, which was recently awarded an R&D; 100 Award, presented by R&D; Magazine in a ceremony at Caesar’s Palace in Las Vegas. This “Oscar of Innovation” takes its place in Dow Electronic Materials’ trophy case, next to the 2015 Edison Award.

Behind the Scenes of Dow’s Finalists for the 2015 R&D; 100 Awards: Part 2 | SOLDERON™ BP TS 6000 Tin-Silver

October 20, 2015

Tin-Silver-Capped Copper Micro Pillars

This series interviews Dow experts who were pivotal to the development and commercialization of innovative chemistries that are finalists for the 2015 R&D; 100 Awards. In Part 2, Wataru Tachikawa talks about the changing requirements in advanced wafer-level packaging (AWLP) and how SOLDERON™ BP TS 6000 Tin-Silver meets them.

Three Dow Electronic Materials Technologies Named Finalists for 2015 R&D; 100 Awards

August 19, 2015

Dow was recently highlighted as a leading innovator with 21 products selected as finalists for the 2015 R&D 100 Awards. Three of these are technologies developed by Dow Electronic Materials as market-focused solutions and commercialized in the last year.

Next-Generation Copper, Nickel and Lead-Free Metallization Products for Next-Generation Devices and Applications

August 15, 2015

Meeting the challenging requirements of next-generation devices destined for Internet of Things applications necessitates metallization products that can address fine feature sizes and geometries of today’s advanced chip and package designs. This presentation details how Dow Electronic Materials has optimized its family of advanced electronics packaging metallization products.

How Do Tin-Silver Caps Influence Reliability of Copper Pillar Applications?

July 23, 2015

As packaging technologies must address the higher performance and increased functionality of today’s electronic devices, traditional C4 bumps are reaching their limits. The industry is turning to Cu pillars as a solution for fine pitch bumping, with tin-silver caps becoming the solder capping material of choice. In this interview, Dr. Jianwei Dong explains why.

SOLDERON™ BP TS 6000 Tin-Silver Honored by the Prestigious Edison Awards for Getting the Lead Out

July 07, 2015

tin_silver_thumb

In common vernacular, “getting the lead out” is a phrase that means, “hurry up!” In the electronics industry, the expression is taken quite literally, with manufacturers needing to find a lead-free alternative to tin-lead solders for wafer bumping processes. Tin-silver plating chemistry has stepped in to fill the role.