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Showing all articles related to Electrolytic plating

Next-Generation Copper, Nickel and Lead-Free Metallization Products for Next-Generation Devices and Applications

August 15, 2015

Meeting the challenging requirements of next-generation devices destined for Internet of Things applications necessitates metallization products that can address fine feature sizes and geometries of today’s advanced chip and package designs. This presentation details how Dow Electronic Materials has optimized its family of advanced electronics packaging metallization products.

How Do Tin-Silver Caps Influence Reliability of Copper Pillar Applications?

July 23, 2015

As packaging technologies must address the higher performance and increased functionality of today’s electronic devices, traditional C4 bumps are reaching their limits. The industry is turning to Cu pillars as a solution for fine pitch bumping, with tin-silver caps becoming the solder capping material of choice. In this interview, Dr. Jianwei Dong explains why.

3D TSV Plating and Bumping: Rising to the Challenge

July 22, 2015

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3D integration using through silicon vias (TSVs) promises a fundamental shift for current multi-chip integration and packaging approaches, but it brings more difficulties in Cu electroplating. This piece explores process and material optimization efforts to enable volume manufacturing of 3D ICs.

Solving Data Center Reliability Challenges through Packaging

July 07, 2015

The semiconductor industry is approaching a point where 2.5D and 3D integration technologies will be required to achieve the performance, bandwidth and storage required of next-generation data centers and mobile devices. In this piece, Wataru Tachikawa explores how the entire ecosystem is rolling up its sleeves and working to overcome the remaining challenges.

SOLDERON™ BP TS 6000 Tin-Silver Honored by the Prestigious Edison Awards for Getting the Lead Out

July 07, 2015

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In common vernacular, “getting the lead out” is a phrase that means, “hurry up!” In the electronics industry, the expression is taken quite literally, with manufacturers needing to find a lead-free alternative to tin-lead solders for wafer bumping processes. Tin-silver plating chemistry has stepped in to fill the role.