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Showing all articles related to Colloidal silica slurry

Performance Gains in CMP Slurry for Advanced Semiconductor Nodes

December 07, 2016

In a recent Solid State Technology article, Dow authors report on some of the complexities in chemical mechanical planarization (CMP) processes at advanced semiconductor nodes. Dow’s new OPTIPLANE™ slurry platform demonstrates excellent performance in meeting new process needs.

Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 1 of 2

August 17, 2016

In part one of this interview series, Dow's Adam Manzonie explains how the new OPTIPLANE™ CMP slurry platform meets requirements for 14nm node processes and below, which are much more sophisticated than those used for less advanced nodes. The OPTIPLANE™ CMP slurry family consists of Dow’s most advanced slurries for dielectric chemical mechanical planarization (CMP).

Developing CMP Consumables for New IC Materials

December 07, 2015

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The semiconductor industry has pushed the limits of miniaturization such that new materials will need to be integrated into more complex structures to continue further scaling. Given the vast number of materials interactions, CMP R&D requires a systems perspective to comprehend the optimal combination of pad and slurry for a target application.