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Showing all articles related to CMP for semiconductor manufacturing

Dow Electronic Materials Taiwan Site Holds Groundbreaking Ceremony for Expansion Project

June 23, 2016

Dow Electronic Materials held a groundbreaking ceremony at its Asia CMP Manufacturing and Technical Center in Hsinchu, Taiwan. Invited guests joined Dow Taiwan leaders in the ceremony events

Dow Taiwan recently hosted a groundbreaking ceremony at its Asia CMP Manufacturing and Technical Center to mark the beginning of construction. Dow will increase production capacity of materials for conventional and next-generation chemical mechanical planarization (CMP) pads in a multi-functional building close to the business’ existing facility in Hsinchu Science Park.

Dow Electronic Materials Launches OPTIPLANE™ CMP Slurry Platform for Advanced Semiconductor Manufacturing

June 08, 2016

OPTIPLANE CMP slurry platform for advanced semiconductor manufacturing

Advanced semiconductor manufacturing continues to follow the projections of Moore’s Law, making process specifications increasingly stringent with a greater need than ever for defect reduction. In response to these emerging requirements, Dow Electronic Materials recently launched its new OPTIPLANE™ slurry platform for chemical mechanical planarization (CMP) for advanced semiconductor devices.

Dow CMP to Present at Inaugural Strategic Materials Conference Korea

May 05, 2016

The Strategic Materials Conference will be hosted in Seoul, Korea for the first time in 2016.

Dow is honored to participate in the inaugural Strategic Materials Conference Korea. We will discuss the need for advanced CMP materials to achieve scaling as the industry moves below 10 nm, and address the challenges faced by semiconductor materials suppliers for next-generation manufacturing.

Dow’s Litho and CMP Teams to Present at CSTIC 2016

March 02, 2016

CSTIC 2016 will be held in Shanghai

Dow is a proud participant in this year’s CSTIC conference, where we will present papers about some of our recent work in lithography and chemical mechanical planarization (CMP) technology. The conference will be held March 13-14, 2016 in conjunction with SEMICON China in Shanghai.

Dow Recognized by TSMC with Supplier Excellence Award for CMP Materials

December 17, 2015

2015 Excellent Performance Award for Dow’s CMP Materials from the Taiwan Semiconductor Manufacturing Company (TSMC)

Dow Electronic Materials is honored to have received a 2015 Supplier Excellence Award from TSMC for performance in the development and delivery of materials for chemical mechanical planarization (CMP).

Behind the Scenes of Dow’s Finalists for the 2015 R&D; 100 Awards: Part 3 | IKONIC™ 2000 CMP Polishing Pads

November 12, 2015

IKONIC Polishing Pad

This is the third installment of Dow’s R&D 100 Awards interview series, which delves into the three Dow Electronic Materials products named as finalists. In this interview, Dow’s Marty DeGroot explains the innovations behind the technology, and how the IKONIC™ CMP polishing pad series is addressing next-generation customer requirements.

Three Dow Electronic Materials Technologies Named Finalists for 2015 R&D; 100 Awards

August 19, 2015

Dow was recently highlighted as a leading innovator with 21 products selected as finalists for the 2015 R&D 100 Awards. Three of these are technologies developed by Dow Electronic Materials as market-focused solutions and commercialized in the last year.

Materials Considerations for Next-Gen Semiconductor Architectures (Part 1 of 2)

July 07, 2015

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The semiconductor industry has been going through some rapid and radical metamorphoses over the past few years, which means taking new elements into consideration, such as battery size and life, security and integration of MEMS, sensors and RF devices. What does this mean for the consumable suppliers to the semiconductor industry?