As packaging trends in microelectronics evolve to necessitate higher densities through miniaturization, new package designs and substrates must also be considered. To satisfy these trends, novel dielectric materials with specific performance characteristics will become critical components of the advanced technologies, which includes fan-out packaging. To address this trend, Dow will present recent results for laminates based on benzocyclobutene (BCB) polymers, which are uniquely qualified to satisfy the demands of next-generation packaging.
Additionally, some of the key drivers for next-generation packages include the need to deliver higher functionality and increased interconnect density in a thinner package while reducing the overall packaging cost to the industry. Photoimageable polymeric dielectric materials play a key role in building these new wafer-level packages (WLPs) and Dow will introduce our new development to address these drivers.
Dow Electronic Materials will present the following topics on dielectric materials during Sessions 4:
Photopatternable Laminate BCB-based Dielectric for Advanced Packaging
Corey O'Connor, Dow Electronic Materials (Tina Aoude, Robert Barr, Jeffrey Calvert, Michael Gallagher, Elissei Iagodkine, Jong-Uk Kim, Tanja Braun, Robert Gernhardt, Karin Hauck, Klaus-Dieter Lang, Piotr Mackowiak, Michael Töpper, Martin Wilke, Markus Wöhrmann)
9:00 - 9:30 a.m., Wednesday, April 27
Laminates are particularly suited to applications such as fan-out panel-level packaging (FOPLP) as well as advanced substrates with smaller line spacing for mobile applications. Advantages include the ability to coat large-area panels, the ability to tent and protect through vias, use as a through silicon via filling material, and the avoidance of thinning over pad corners or copper redistribution layers while maintaining good conformal performance. The laminate coating thickness can also be optimized over a wide range, generally 2µm to 50µm, with good uniformity. Depending on the application, the laminate may be based on divinylsiloxane-bis-benzocyclobutene (DVS-bis-BCB) polymer or aqueous-developable BCB (AD-BCB) polymer. The two versions of photopatternable BCB-based laminate are negative tone and may be patterned using various means. Aspect ratios of 1:1 are approached by patterning with a broadband exposure tool such as the Süss MicroTec Mask Aligner, ASML i-line stepper, or through laser direct imaging with a tool such as the Orbotech Ultra 200. Post-patterning, the DVS-bis-BCB laminate is developed using a solvent blend, while the AD-BCB laminate may be developed using a standard TMAH-based aqueous developer. Alternatively, laser ablation, such as with a Süss Photonics 248nm excimer laser and photomask, can produce aspect ratios approaching 4:1. A post-rinse to clean ablation debris may be necessary in place of solvent or aqueous development. BCB-based laminate properties including low dielectric constant, low loss, high breakdown voltage, high thermal stability, and excellent moisture and copper barrier properties are viewed as necessary attributes in next-generation packaging.
Link to abstract
Thick Film Aqueous Developable Photodielectric Material for Advanced Packaging Applications
Michael Gallagher, Dow Electronic Materials (Joe Lachowski, Rosemary Bell, Kevin Wang, Masaki Kondo, Yuta Anezaki, Janet Okada, David Louks, Michelle Riener, Hua Dong, Greg Prokopowicz, Duane Romer, Wes Sattler, Bob Barr, Dave Fleming, Tina Aoude, Jenna Cordero)
11:15 - 11:45 a.m., Wednesday, April 27
Photoimageable polymeric dielectric materials play a key role in building new WLPs, and thinner multi-die packages are driving additional requirements for improved higher lithographic performance and reduced copper diffusivity. Dow Electronic Materials’ new thick film positive-tone material, INTERVIA™ Photodielectric 7110, meets industry targets while maintaining the excellent copper barrier properties of previous generations of Dow’s photodielectric products. This new 0.26N TMAH aqueous developable photodielectric has been designed to achieve improved lithographic performance at film thicknesses of up to 15 microns, allowing patterning of a 5μm via in a 10μm thick film corresponding to an aspect ratio of 2:1. We have optimized the product to prevent pattern lifting during the development process, and to maintain excellent adhesion during multilayer buildup, after both cure and pressure cooker treatment, for a wide variety of materials including silicon oxynitride, silicon oxide, epoxy mold compound, and electroplated copper.
Link to abstract