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Showing all articles related to CMP Pad

Dow Electronic Materials Taiwan Site Holds Groundbreaking Ceremony for Expansion Project

June 23, 2016

Dow Electronic Materials held a groundbreaking ceremony at its Asia CMP Manufacturing and Technical Center in Hsinchu, Taiwan. Invited guests joined Dow Taiwan leaders in the ceremony events

Dow Taiwan recently hosted a groundbreaking ceremony at its Asia CMP Manufacturing and Technical Center to mark the beginning of construction. Dow will increase production capacity of materials for conventional and next-generation chemical mechanical planarization (CMP) pads in a multi-functional building close to the business’ existing facility in Hsinchu Science Park.

Dow’s Litho and CMP Teams to Present at CSTIC 2016

March 02, 2016

CSTIC 2016 will be held in Shanghai

Dow is a proud participant in this year’s CSTIC conference, where we will present papers about some of our recent work in lithography and chemical mechanical planarization (CMP) technology. The conference will be held March 13-14, 2016 in conjunction with SEMICON China in Shanghai.

Dow Recognized by TSMC with Supplier Excellence Award for CMP Materials

December 17, 2015

2015 Excellent Performance Award for Dow’s CMP Materials from the Taiwan Semiconductor Manufacturing Company (TSMC)

Dow Electronic Materials is honored to have received a 2015 Supplier Excellence Award from TSMC for performance in the development and delivery of materials for chemical mechanical planarization (CMP).

Developing CMP Consumables for New IC Materials

December 07, 2015

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The semiconductor industry has pushed the limits of miniaturization such that new materials will need to be integrated into more complex structures to continue further scaling. Given the vast number of materials interactions, CMP R&D requires a systems perspective to comprehend the optimal combination of pad and slurry for a target application.

Behind the Scenes of Dow’s Finalists for the 2015 R&D; 100 Awards: Part 3 | IKONIC™ 2000 CMP Polishing Pads

November 12, 2015

IKONIC Polishing Pad

This is the third installment of Dow’s R&D 100 Awards interview series, which delves into the three Dow Electronic Materials products named as finalists. In this interview, Dow’s Marty DeGroot explains the innovations behind the technology, and how the IKONIC™ CMP polishing pad series is addressing next-generation customer requirements.

Join Dow’s CMP Team at ICPT 2015

September 25, 2015

Dow is proud to be a sponsor and participant at the 2015 International Conference on Planarization/CMP Technology (ICPT) taking place in Chandler, Ariz. Sept. 30 to Oct. 2, 2015. This year, we will be giving three presentations during the conference, which are previewed in this short article.

CMP Cost Reduction by Optimal Pad Selection

August 25, 2015

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Yield loss is widely recognized the greatest cost in high-volume manufacturing (HVM) of commercial integrated circuit IC devices, and so significant cost-reduction comes from improving device yields. This article explores how CMP pad design can reduce defects, leading to higher wafer yields.

Three Dow Electronic Materials Technologies Named Finalists for 2015 R&D; 100 Awards

August 19, 2015

Dow was recently highlighted as a leading innovator with 21 products selected as finalists for the 2015 R&D 100 Awards. Three of these are technologies developed by Dow Electronic Materials as market-focused solutions and commercialized in the last year.

Material Considerations for the IOT and Heterogeneous Integration (Part 2 of 2)

August 06, 2015

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The semiconductor industry has been going through rapid and radical change in the past few years. Mobile and wireless computing, and the IoT call for taking other elements into consideration. Part 2 of this series looks at the new device technologies needed to enable the IoT.

CMP Pad Selection for 28nm Node and Beyond

July 07, 2015

The “one-size-fits-all” approach to CMP processing is no longer viable; a tunable platform of products is required to meet manufacturers ever-evolving and more technically challenging manufacturing needs. The IKONIC™ CMP pad platform is uniquely positioned to address future IC fabrication requirements because of the tunability of its materials properties.