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Showing all articles related to Slurry

Dow to Present on Acidic CMP Slurry and Advanced Patterning at CSTIC

March 10, 2017

Dow will be at the China Semiconductor Technology International Conference with presentations on work from our CMP and lithography teams. One seminar will share findings on acidic ILD slurries, and the second will discuss lithographic materials when moving beyond 10nm.

Performance Gains in CMP Slurry for Advanced Semiconductor Nodes

December 07, 2016

In a recent Solid State Technology article, Dow authors report on some of the complexities in chemical mechanical planarization (CMP) processes at advanced semiconductor nodes. Dow’s new OPTIPLANE™ slurry platform demonstrates excellent performance in meeting new process needs.

Hear from Dow’s Experts at the ICPT CMP Conference in Beijing

October 03, 2016

The International Conference on Planarization/CMP Technology (ICPT) will be held in Beijing, China, October 17-19, 2016. Dow Electronic Materials will be well-represented at this leading CMP conference with session topics on materials and metrology, as well as poster presentations dedicated to some of our newest CMP pad and slurry technology.

Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 2 of 2

September 13, 2016

Part two of this interview with Dow's Adam Manzonie examines Dow’s recently launched OPTIPLANE™ CMP slurry platform, focusing on the market drivers and steps to commercialization to deliver a total solution to meet 14nm chemical mechanical planarization (CMP) requirements.

Dow's Michelle Ho, Ph.D., to Discuss CMP Slurry for TSV at SEMICON Taiwan

September 01, 2016

The complexity of through-silicon via (TSV) geometry has increased the difficulty of global uniformity after the chemical mechanical planarization (CMP) process. At SEMICON Taiwan, Dow’s Michelle Ho, Ph.D., will address this in a presentation, "Expandable and Tunable CMP Slurry Platform for TSV Applications," as part of the CMP Forum on September 7, 2016.

Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 1 of 2

August 17, 2016

In part one of this interview series, Dow's Adam Manzonie explains how the new OPTIPLANE™ CMP slurry platform meets requirements for 14nm node processes and below, which are much more sophisticated than those used for less advanced nodes. The OPTIPLANE™ CMP slurry family consists of Dow’s most advanced slurries for dielectric chemical mechanical planarization (CMP).

Dow Electronic Materials Launches OPTIPLANE™ CMP Slurry Platform for Advanced Semiconductor Manufacturing

June 08, 2016

OPTIPLANE CMP slurry platform for advanced semiconductor manufacturing

Advanced semiconductor manufacturing continues to follow the projections of Moore’s Law, making process specifications increasingly stringent with a greater need than ever for defect reduction. In response to these emerging requirements, Dow Electronic Materials recently launched its new OPTIPLANE™ slurry platform for chemical mechanical planarization (CMP) for advanced semiconductor devices.

Dow’s Litho and CMP Teams to Present at CSTIC 2016

March 02, 2016

CSTIC 2016 will be held in Shanghai

Dow is a proud participant in this year’s CSTIC conference, where we will present papers about some of our recent work in lithography and chemical mechanical planarization (CMP) technology. The conference will be held March 13-14, 2016 in conjunction with SEMICON China in Shanghai.

Dow Recognized by TSMC with Supplier Excellence Award for CMP Materials

December 17, 2015

2015 Excellent Performance Award for Dow’s CMP Materials from the Taiwan Semiconductor Manufacturing Company (TSMC)

Dow Electronic Materials is honored to have received a 2015 Supplier Excellence Award from TSMC for performance in the development and delivery of materials for chemical mechanical planarization (CMP).

Join Dow’s CMP Team at ICPT 2015

September 25, 2015

Dow is proud to be a sponsor and participant at the 2015 International Conference on Planarization/CMP Technology (ICPT) taking place in Chandler, Ariz. Sept. 30 to Oct. 2, 2015. This year, we will be giving three presentations during the conference, which are previewed in this short article.