Dow Electronic Materials
Advanced Chip Packaging - Metallization
Dow Electronic Materials has a long history of invention and innovation in electroplating chemistry, and the company’s portfolio delivers many of the materials that are essential for the most advanced wafer-level, flip chip, system-in-package, package-on-package and 3D packaging schemes.
We are currently in an era in which chip packaging is increasingly responsible for better performance and more functionality in consumer electronics. This drive towards better performance is predicated in large part on innovation in metallization that directly enables substantial performance improvements in chip packaging, which includes higher I/O speeds, easier, more efficient stacking, more compact designs with smaller form factors, and, of course, 3D packaging.
- Copper for Wafer-level Packaging
- Damascene Copper
- Wafer Bumping
- Electrolytic Wafer Plating Process
- Under Bump Metallization