Dow Electronic Materials
ProBond™ 484 Black Oxide
| Improved Wetting of Resin, Higher Adhesion | |
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Before Converter |
After Converter (Reduced Oxide)  |
| Excellent Microvia Shape | |
PROBOND™ 484 Oxide is the most widely used black oxide product world-wide to promote innerlayer adhesion of copper in multi-layer circuit board fabrication. This product works well for both traditional applications and also for direct laser drilling applications for HDI PCB fabrication.
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For Traditional Applications, in combination with PC Oxide Convertor:
- Applicable to wide range of laminate materials
- Excellent performance on high layer count applications
- High peel strength on high Tg epoxy laminate
- High stability for ease of control
- Long bath life
Key Benefits:
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For HDI Applications:
- Compatible with Direct Laser Drilling process
- Simplified HDI process, cost effective solution
- Excellent microvia shape after hole formation
- Reduced failure due to hole registration issues
- Improved microvia yield rates
Key Benefits: