Dow Electronic Materials
Printed Circuit Boards - IC Substrate
Dow Electronic Materials is your ideal partner to provide a total solution for metalizing finer line and space patterns on next generation IC substrates.
The continuous miniaturization of circuit features on packaging substrates makes it increasingly challenging for manufacturers to deliver high performance and highly reliable substrates at high yields. Dow Electronic Materials has a dedicated group of experienced scientists and engineers to deliver innovative and cost effective solutions to address these challenges.
- Desmear Solution for SAP
- Electroless Copper for SAP
- Electroless Copper for Core
- Electroless Copper for MSAP
- Electrolytic Copper
- Electroless Palladium
- Electroless Nickel and Immersion Gold