Dow Electronic Materials
CIRCUPOSIT™ 7900 Electroless Copper for SAP

Fine Grain Structure	Excellent Via Bottom Coverage
10um L/S after flash etch

CIRCUPOSIT™ 7900 Electroless Copper Process has been specifically developed for SAP applications. The new CIRCUPOSIT™ SAP Conditioner provides uniform copper deposits by ensuring even absorbtion catalyst on dielectric materials.

Key Benefits:
• Fine deposit grain structure
• Excellent electroless copper coverage including in microvias
• Excellent peel strength after HAST & Reflow
• Uniform thickness
• Excellent via reliability
• High migration resistance
• Excellent bath stability