Dow Electronic Materials
Printed Circuit Boards - Multi-layer Boards
Dow provides metallization and imaging technology products and services to the printed circuit board and IC substrate manufacturers to enable production of powerful, multi-layer circuit boards in computers, cell phones, automobiles and many other electronic devices.
We are innovating and delivering exceptional service to our customers.
- Innerlayer Bonding
- Making Holes Conductive
- Electroless Copper
- Electrolytic Copper
- Final Finishes
- Electroless Palladium
- Electroless Nickel and Immersion Gold